Engineering.com

Cisco adds Supermicro systems to Secure AI Factory with NVIDIA

The expanded portfolio will include liquid- and air-cooled compute systems, with availability beginning in October 2026.

Nordson introduces Vantage XL for panel-level packaging

The fluid dispensing platform supports large semiconductor panels with thermal management, alignment and warpage control.

51WORLD unveils two embodied AI products

The company also outlined a three-tier aerospace strategy spanning low-altitude systems, space and deep-space exploration.

Redwire and Kanematsu team up for Japan space market

Kanematsu will support Redwire business development in Japan for space infrastructure, power systems, payloads and robotics.